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Digital signal integrity-modeling and simulation with interconnects and package

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He is the author of the book “Digital Signal Integrity Modeling and Simulation with Interconnects and Packages” and has authored 33 papers and conference Digital Communications Test and Measurement HighSpeed Physical Layer Characterization; Digital Signal Integrity Modeling and Simulation with Interconnects and Packages

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Digital Signal Integrity Modeling and Simulation with Interconnects and Packages Digital Signal Integrity Modeling and Simulation with Interconnects and Packages “Digital Signal Integrity Modeling and Simulation with Interconnects and Packages” by Brian Young “MECL System Design Handbook,” Motorola Semiconductor Products, Inc.

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Brian Young, Digital Signal Integrity Modeling and Simulation with Interconnect and Packages, Prentice Hall, 2000, pp. 391393. 6. Doug Brooks, \"Differential Signals Digital Communications Test and Measurement HighSpeed Physical Layer Characterization; Digital Signal Integrity Modeling and Simulation with Interconnects and Packages Download mp3 audio book. Brian Young Digital Signal Integrity Modeling and Simulation with Interconnects and Packages. Prentice Hall, Inc., NJ, 2000.